2026-09-07
|
Customer |
A semiconductor consumables manufacturer — specializing in wafer dicing and cleaning fluid production |
|
Industry |
Semiconductor Electronic Chemicals |
|
Product |
Semiconductor-grade grinding / cleaning fluid (1–5 L fills) |
|
Equipment Supplied |
Flow meter filler · Buffer tank · Rotary capper · Print-and-apply labeler · Vision inspection · Box opener · Case packer · Lane divider · Checkweigher · Box sealer · Palletizer · Conveyor system |
|
Service Scope |
Layout planning · anti-contamination engineering · full-line integration · commissioning |
Scaling up semiconductor cleaning fluid production is not simply a matter of buying more machines. Three interlinked problems had to be solved first:
We designed the complete line around the customer's throughput target and purity specification, treating each machine as part of a single integrated system.
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Line throughput reached the design target of 1,500 bottles/hour — achieved through integrated layout that eliminated all manual inter-station transfers.
Fill accuracy held at ±0.5% across the full bottle range, eliminating net-weight rework.
Zero contamination incidents recorded at the wetted path — 304 SS construction and PLC interlocks met semiconductor-grade cleanliness requirements.
Operator headcount per shift reduced as vision inspection and automated rejection replaced manual quality checks at capping and filling stations.
Q1: What materials are used in the product-wetted path?
All surfaces in direct contact with the fluid are 304 stainless steel or food-grade P-standard flexible hose. The buffer tank is full SUS316 with a rotary ball CIP system. These choices meet the cleanliness standard required for semiconductor-grade chemical dispensing.
Q2: Can the line accommodate multiple bottle sizes without changeover?
Yes. The flow meter filler handles bottles from Φ40 to Φ160 mm in diameter and fills from 1 to 5 L — all within the same configuration. Fill parameters are adjusted via PLC; no mechanical changeover is required within this range.
Q3: How is throughput adjusted after installation?
The entire conveyor network uses Danfoss variable-frequency drives, allowing line speed to be tuned from a central control point without any mechanical changes. The filling and capping machines are both rated to ≤1,500 BPH, giving headroom to run at lower speeds during ramp-up or format transitions.
Our engineering team designs complete filling and packaging systems tailored to your product, container range, throughput target, and facility layout — from the first sketch to on-site commissioning.
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